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Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡
2. 8 DIMMs; up to 2TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM
3. 1 PCI-E 3.0 x16 (LP) slot
4. Dedicated IPMI 2.0 LAN
5. 3 Hot-swap 3.5" SATA3 drive bays
6. 2 SATA DOM + 1 SATA/NVMe
M.2 (22110/2280)
7. Up to 1600W Redundant Power Supplies
Titanium Level (96%)
Rozmiar | 2U Rackmount |
---|---|
Liczba modułów (node) | 4 |
Obudowa | CSE-827HQ-R1K68BP3 |
Płyta główna | 4x Super X11DPT-L |
CPU | Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake / per node |
RAM | 8 DIMMs; up to 2TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM per node |
PCI-Express | 1 PCI-E 3.0 x16 (LP) slot per node |
IPMI | Dedicated IPMI 2.0 LAN per node |
Drive Bays | 3 Hot-swap 3.5" SATA3 drive bays per node |
PSU | Up to 1600W Redundant Power Supplies Titanium Level (96%) |